3d Chip, Powerful Leading Power

Are you a 3D movie fan? If so, there is good news for you. With the success of 3D movies like Avatar and with the increasing interconnect densities and increasing cost of IC manufacturing in leading edge technology nodes, 3D architectures for IC integration and packaging are becoming viable alternatives to the standard 2D designs. Recently, Japanese electronics giant Sharp unveiled a line of 3D televisions. This is an example of the fact that 3D TV has been one of the biggest technology stories of the year so far and has a promosing future.

The fast development of 3D TV contributes to the acceleration of 3D chips.
Interestingly, 3D technology is emerging as numerous other paradigms in silicon technology and system design are shifting. One of the basic advantages of 3D structures is the improved volumetric density as well as allowing the connections between the components to be shorter. This,in turn, allows those connections to be faster and more power efficient. At the same time, 3D technology provides improved interconnectivity with the increased number of neighbors in both lateral and vertical dimensions.

Today, a large number of academic groups and companies are involved in 3D research. Vertically integrated chips have become available commercially in embedded, wireless, and memory devices. Systems in these sectors have strict area and volume limitations. Hence, shrinking the chip footprint delivers high value in the corresponding markets. The microprocessor sector will likely be next to adopt 3D integration, but the value proposition is clearly different, with the focus on improved interconnectivity, packaging density, memory latency, and bandwidth improvement as well as heterogeneous integration. Related IC for 3D chip is: TC4S66F.
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